Measuring the solder-wave height on wave soldering machines
When soldering printed circuit boards in wave soldering systems, the height of the solder wave is an important criterion for the quality of the solder joints. The level of the soldering tin is detected directly above the solder wave using an eddyNCDT displacement sensor. The influence of the solder pot level and the pump contamination is thereby compensated for. When soldering printed circuit boards in wave soldering systems, the height of the solder wave is an important criterion for the quality of the solder joints. The level of the soldering tin is detected directly above the solder wave using an eddyNCDT displacement sensor. The influence of the solder pot level and the pump contamination is thereby compensated for.
When soldering printed circuit boards in wave soldering systems, the height of the solder wave is an important criterion for the quality of the solder joints. The level of the soldering tin is detected directly above the solder wave using an eddyNCDT displacement sensor. The influence of the solder pot level and the pump contamination is thereby compensated for. When soldering printed circuit boards in wave soldering systems, the height of the solder wave is an important criterion for the quality of the solder joints. The level of the soldering tin is detected directly above the solder wave using an eddyNCDT displacement sensor. The influence of the solder pot level and the pump contamination is thereby compensated for.
Application challenge
When soldering printed circuit boards in wave soldering systems, the height of the solder wave is an important criterion for the quality of the solder joints. The level of the soldering tin is detected directly above the solder wave using an eddyNCDT displacement sensor. The influence of the solder pot level and the pump contamination is thereby compensated for.
Measurement method and system
When soldering printed circuit boards in wave soldering systems, the height of the solder wave is an important criterion for the quality of the solder joints. The level of the soldering tin is detected directly above the solder wave using an eddyNCDT displacement sensor. The influence of the solder pot level and the pump contamination is thereby compensated for.
The problem
When soldering printed circuit boards in wave soldering systems, the height of the solder wave is an important criterion for the quality of the solder joints. The level of the soldering tin is detected directly above the solder wave using an eddyNCDT displacement sensor. The influence of the solder pot level and the pump contamination is thereby compensated for.
The method
When soldering printed circuit boards in wave soldering systems, the height of the solder wave is an important criterion for the quality of the solder joints. The level of the soldering tin is detected directly above the solder wave using an eddyNCDT displacement sensor. The influence of the solder pot level and the pump contamination is thereby compensated for.