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Measurement solutions for Semiconductors and electronics

Nanometre measurement in vacuum and cleanroom

Semiconductor manufacturing equipment needs sub-nanometre resolution, vacuum compatibility and zero particle generation. Capacitive and confocal chromatic sensors deliver all three, and we integrate them with the controller and the software that records the result.

Applications

  • 3D shape measurement of wafers

    reflectCONTROL deflectometry systems are used to detect the flatness or planarity of 150 mm wafers. These measure the flatness with only one image. For this purpose, the sensors project a striped pattern onto the wafer, which is recorded by…

    Industry: Semiconductors and electronics
  • CAST 2 Cast 2 controls and monitors the measurement data from our spin tester to ensure optimal processes and quality.

    CAST 2: A precise measurement and control system for spin stands. Digital interface, comprehensive process integration, and analysis.

    Industry: Semiconductors and electronics
  • Height measurement of wafer bumps

    Up to now, the 50 to 350 µm small bumps are normally inspected by camera systems during production. The decisive disadvantage of this method is that only the presence or position is checked. The height can only be determined offline, by…

    Industry: Semiconductors and electronics
  • Next-level Wavefront metrology for Wafer-level optics

    Fast, automated wavefront measurement of imaging quality of individual lenses, micro lenses, their tools and master molds

    Industry: Semiconductors and electronics
  • Positioning of the lens system in lithography machines

    Non-contact, inductive displacement sensors (eddy current) measure the position of lens elements in order to achieve the highest possible imaging accuracy. Depending on the lens system, displacement sensors from Micro-Epsilon are used to…

    Industry: Semiconductors and electronics
  • Positioning the wafer stage

    Non-contact sensors from Micro-Epsilon are used for position monitoring of the wafer stage, where they measure highly dynamic XYZ movements of the stage which accelerates very rapidly. Capacitive and inductive (eddy current) sensors achieve…

    Industry: Semiconductors and electronics
  • Positioning the wafer stage using capacitive sensors

    Capacitive displacement sensors are used for fine positioning tasks in the wafer stage. These sensors measure the position of the stage at various points, which is particularly useful for fine alignment. Thanks to their triaxial design, the…

    Industry: Semiconductors and electronics
  • Thickness and structure measurement of solar wafers

    The production of solar wafers starts with the raw wafers that are sawn from the so-called ingots. These must comply with a specified thickness of about 180 µm to be processed further as a good part. The production of solar wafers starts…

    Industry: Semiconductors and electronics
  • Wafer planarity control for hybrid bonding

    Measure wafer or die shape deviations in real time before hybrid bonding. Capacitive distance-sensor arrays scan wafer surfaces; the measurement data supports adaptive leveling and Z-axis position correction of wafer stages.

    Industry: Semiconductors and electronics
  • Wafer thickness and TTV

    Confocal chromatic measurement of total thickness variation without touching the wafer.

    Micro-Epsilon displacement sensors
  • Chuck flatness

    Capacitive displacement measurement at sub-nanometre resolution, vacuum compatible.

    Micro-Epsilon displacement sensors
  • Stage position feedback

    High-bandwidth displacement feedback for precision positioning loops.

    Micro-Epsilon displacement sensors

Frequently asked questions

Answers to the most common questions about our products and services

Usually five to ten working days from when your samples reach our lab. You get a written report with the measured results and a recommended configuration.

Both. We can supply the instrument alone, or install, align, configure and prove it on your line with a measurement capability test before handover.

Documented applications include wafer planarity, shape and thickness inspection; detection of bumps, saw marks and cracks; and positioning masks, wafer stages, lenses and lithography machinery. Select a solution for the specific task and target material.

Manufacturer examples use capacitive, confocal chromatic, eddy-current, white-light interferometry, optical micrometer, profile-scanning and deflectometry technologies. Choose according to geometry, target material, process rate and operating environment.

Vacuum suitability cannot be generalized across technologies or configurations. Verify the exact model, sensor head, cable, feedthroughs and components inside the vacuum space against the process conditions.

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