Wafer planarity control for hybrid bonding
Measure wafer or die shape deviations in real time before hybrid bonding. Capacitive distance-sensor arrays scan wafer surfaces; the measurement data supports adaptive leveling and Z-axis position correction of wafer stages.
Measure wafer or die shape deviations in real time before hybrid bonding. Capacitive distance-sensor arrays scan wafer surfaces; the measurement data supports adaptive leveling and Z-axis position correction of wafer stages.
Application challenge
Measure wafer or die shape deviations in real time before hybrid bonding.
Measurement conditions
Depending on the task, arrays inspect upper and lower wafers and may use segmented chuck areas for local leveling. No exact sensor model or performance value is named.
Measurement method and system
Capacitive distance-sensor arrays scan wafer surfaces; the measurement data supports adaptive leveling and Z-axis position correction of wafer stages.
System components named by the manufacturer
- capacitive distance sensors
The problem
Measure wafer or die shape deviations in real time before hybrid bonding.
Conditions
Depending on the task, arrays inspect upper and lower wafers and may use segmented chuck areas for local leveling. No exact sensor model or performance value is named.
The method
Capacitive distance-sensor arrays scan wafer surfaces; the measurement data supports adaptive leveling and Z-axis position correction of wafer stages.