Micro-Epsilon introduces reflectCONTROL RCS3500-300 for full-field warpage measurement of 300 mm wafers
Warpage, bow and flatness of wafers up to 300 mm in a single acquisition.
On 4 November 2026 Micro-Epsilon introduced the reflectCONTROL RCS3500-300, a 3D sensor for full-field warpage and flatness measurement of wafers up to 300 mm in diameter. According to the manufacturer, the whole wafer surface is captured in one acquisition, without mechanical scanning or stitching of partial measurements, giving one consistent 3D data set.
The deflectometry principle is particularly suited to highly reflective surfaces such as polished wafers. The manufacturer states acquisition times from 1 s and OK/NOK evaluation, so the controller can react through its I/O signals and reject a deformed wafer before the next process step.
For line integration, together with the Industrial Performance Unit, the sensor supports PROFINET, EtherCAT and EtherNet/IP. A software development kit based on GigE Vision and GenICam allows point-cloud evaluation in custom software; evaluation in 3DInspect is also possible.
Manufacturer announcement, 4 November 2026 (opens in a new tab)
